DRK-W Series Laser Particle Size Analyzer

Incazelo emfushane:

Izinga eliphezulu le-DRK-W yochungechunge lwezinhlayiyana zokuhlaziya usayizi wezinhlayiyana ze-laser kanye nohlu olubanzi lwamasampula ahloliwe likwenza kusetshenziswe kabanzi emikhakheni eminingi efana nocwaningo lokuhlola lwaselabhorethri nokulawulwa kwekhwalithi yokukhiqiza kwezimboni.


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izinga eliphezulu le-DRK-W yochungechunge lwezinhlayiyana zokuhlaziya usayizi wezinhlayiyana ze-laser kanye nohlu olubanzi lwamasampula ahloliwe likwenza kusetshenziswe kabanzi emikhakheni eminingi efana nocwaningo lokuhlola lwaselabhorethri nokulawulwa kwekhwalithi yokukhiqiza kwezimboni. Isibonelo: izinto zokwakha, amakhemikhali, imithi, izitsha zobumba ezinhle, izinto zokwakha, i-petroleum, amandla kagesi, i-metallurgy, ukudla, izimonyo, ama-polymers, amapende, ama-coatings, i-carbon black, i-kaolin, ama-oxides, ama-carbonates, izimpushana zensimbi, izinto eziphikisayo, izithasiselo, njll. . Sebenzisa i-particle njengento yokukhiqiza, imikhiqizo, okuphakathi, njll.

Ngokukhula nokuthuthuka kwesayensi nobuchwepheshe, sekuvele izinhlayiya ezinhle kakhulu emikhakheni eminingi yomnotho wezwe, njengamandla, amandla, imishini, imithi, imboni yamakhemikhali, imboni yokukhanya, insimbi, izinto zokwakha kanye nezinye izimboni. Izinkinga zobuchwepheshe kusamele zixazululwe, futhi ukukalwa kosayizi wezinhlayiyana kungenye yezinto eziyisisekelo nezibalulekile. Ezimweni eziningi, ubukhulu bosayizi wezinhlayiyana abuthinti nje kuphela ukusebenza kanye nekhwalithi yomkhiqizo, kodwa futhi bunobudlelwane obubalulekile nokuthuthukiswa kwenqubo, ukuncishiswa kokusetshenziswa kwamandla, kanye nokunciphisa ukungcoliswa kwemvelo. Eminyakeni yamuva, izinto ezintsha ezihlukahlukene zezinhlayiya ezihlobene eduze nobuchwepheshe obuphezulu, imboni yezokuvikela kazwelonke, isayensi yezempi, njll., ikakhulukazi ukufika kanye nokusetshenziswa kwama-nanoparticles e-ultrafine, kuye kwabeka izidingo ezintsha neziphakeme zokukalwa kosayizi wezinhlayiyana. Akudingi nje kuphela ukucutshungulwa kwedatha okusheshayo nokuzenzakalelayo, kodwa futhi kudinga idatha ethembekile necebile kanye nolwazi oluwusizo kakhulu ukuze kuhlangatshezwane nezidingo zocwaningo lwesayensi nezinhlelo zokusebenza zokulawula ikhwalithi yezimboni. I-TS-W series laser particle size analyzer iyisizukulwane sakamuva sokuhlaziya usayizi wezinhlayiyana ze-laser esithuthukiswe ngokucophelela ukuze sihlangabezane nezidingo ezintsha ezingenhla zabasebenzisi. Ithuluzi lihlanganisa ukusetshenziswa kobuchwepheshe be-laser obuthuthukisiwe, ubuchwepheshe be-semiconductor, ubuchwepheshe be-optoelectronic, ubuchwepheshe be-microelectronic nobuchwepheshe bekhompyutha, futhi buhlanganisa ukukhanya, umshini, ugesi, nekhompyutha. Izinzuzo ezivelele zobuchwepheshe bokulinganisa usayizi wezinhlayiyana ezisekelwe kumbono wokuhlakazeka kokukhanya kancane kancane Esikhundleni sezinye izindlela ezivamile zokulinganisa, ngokuqinisekile kuzoba isizukulwane esisha sezinsimbi zokulinganisa usayizi wezinhlayiyana. Futhi idlala indima ebaluleke kakhulu ekuhlaziyeni ukusatshalaliswa kosayizi wezinhlayiyana emkhakheni wocwaningo lwesayensi nokulawulwa kwekhwalithi yezimboni.
Izinga eliphezulu le-DRK-W yochungechunge lwezinhlayiyana zokuhlaziya usayizi wezinhlayiyana ze-laser kanye nohlu olubanzi lwamasampula ahloliwe likwenza kusetshenziswe kabanzi emikhakheni eminingi efana nocwaningo lokuhlola lwaselabhorethri nokulawulwa kwekhwalithi yokukhiqiza kwezimboni. Isibonelo: izinto zokwakha, amakhemikhali, imithi, izitsha zobumba ezinhle, izinto zokwakha, i-petroleum, amandla kagesi, i-metallurgy, ukudla, izimonyo, ama-polymers, amapende, ama-coatings, i-carbon black, i-kaolin, ama-oxides, ama-carbonates, izimpushana zensimbi, izinto eziphikisayo, izithasiselo, njll. . Sebenzisa izinhlayiya njengezinto ezingavuthiwe, imikhiqizo, okuphakathi, njll.

Izici zobuchwepheshe:
1. Isiqandisi esiyingqayizivele se-semiconductor elawulwa thermostatically green solid-state laser njengomthombo wokukhanya, enobude obufushane wamaza, usayizi omncane, umsebenzi ozinzile nempilo ende;
2. Okuhloswe ngokuhlukile kokukhanya okunobubanzi obukhulu ukuze kuqinisekiswe ububanzi bokulinganisa obukhulu, asikho isidingo sokushintsha ilensi noma ukuhambisa iseli lesampula ngaphakathi kwebanga eligcwele lokulinganisa lama-microns angu-0.1-1000;
3. Ukuqoqa imiphumela yeminyaka yocwaningo, ukusetshenziswa okuphelele kwethiyori kaMichaelis;
4. I-algorithm ye-inversion eyingqayizivele yokuqinisekisa ukunemba kokulinganisa kwezinhlayiyana;
5. Isixhumi esibonakalayo se-USB, ithuluzi nokuhlanganiswa kwekhompyutha, ikhompyutha yezinga lezimboni eshumekiwe engu-10.8-intshi, ikhibhodi, igundane, idiski ye-U ingaxhunywa
6. Iphuli yesampula ejikelezayo noma iphuli yesampula engaguquki ingakhethwa ngesikhathi sokulinganisa, futhi okubili kungashintshwa njengoba kudingeka;
7. Idizayini ye-Modular yeseli yesampula, izindlela ezihlukene zokuhlola zingenziwa ngokushintsha imojuli; iseli lesampula elijikelezayo linomshini wokusabalalisa owakhelwe ngaphakathi we-ultrasonic, ongahlakaza ngempumelelo izinhlayiya ezihlanganisiwe.
8. Isilinganiso sesampula singazenzakalela ngokugcwele. Ngaphezu kokwengeza amasampula, inqobo nje uma ipayipi lokungena lamanzi acwebile kanye nepayipi lokudonsa kuxhunyiwe, indawo yokungena amanzi, ukulinganisa, ukudonsa amanzi, ukuhlanza, nokusebenza kwedivayisi yokusabalalisa ye-ultrasonic kungenziwa ngokuzenzakalelayo ngokugcwele, futhi amamenyu okulinganisa okwenziwa ngesandla nawo ahlinzekwa. ;
9. Isofthiwe yenziwe ngeyakho, ihlinzeka ngemisebenzi eminingi njengewizadi yokulinganisa, elungele abasebenzisi ukuyisebenzisa;
10. Idatha yomphumela wokulinganisa inothile, egcinwe kusizindalwazi, futhi ingabizwa futhi ihlaziywe nganoma iyiphi imingcele, njengegama lomsebenzisi, igama lesampula, idethi, isikhathi, njll., ukuze kuhlangatshezwane nedatha namanye ama-software;
11. Insimbi yomculo yinhle ngokubukeka, incane ngosayizi futhi ilula ngesisindo;
12. Ukunemba kwesilinganiso kuphezulu, ukuphindaphinda kuhle, futhi isikhathi sokulinganisa sifushane;
13. Isofthiwe inikeza inkomba ye-refractive yezinto eziningi abasebenzisi abangazikhetha ukuhlangabezana nezimfuneko zomsebenzisi zokuthola inkomba ye-refractive yezinhlayiyana ezilinganisiwe;
14. Ngokucabangela izidingo zokugcinwa kuyimfihlo kwemiphumela yokuhlolwa, opharetha abagunyaziwe kuphela abangafaka isizindalwazi esihambisanayo ukuze bafunde idatha futhi bacubungule;
15. Leli thuluzi liyahlangabezana kodwa alikhawulelwe kulawa mazinga alandelayo:
ISO 13320-2009 G/BT 19077.1-2008 Ukuhlaziywa kosayizi we-particle Indlela yokuhlukanisa i-laser

Ipharamitha yezobuchwepheshe:

Imodeli DRK-W1 DRK-W2 DRK-W3 DRK-W4
Isisekelo setiyori Mie scattering theory
Ibanga lokulinganisa usayizi we-particle 0.1-200um 0.1-400um 0.1-600um 0.1-1000um
Umthombo Wokukhanya Ukulawula ukushisa okungaguquki kwesiqandisi se-semiconductor ukukhanya okubomvu ukukhanya okuqinile kwe-laser, ubude be-waveleng 635nm
Iphutha lokuphindaphinda <1% (ukuchezuka okujwayelekile kwe-D50)
Iphutha lokulinganisa <1% (ukuchezuka okujwayelekile kwe-D50, kusetshenziswa ukuhlolwa kwezinhlayiyana okujwayelekile kuzwelonke)
Umtshina 32 noma 48 isiteshi se-silicon photodiode
Isampula yeseli Iphuli yesampula engaguquki, ichibi lesampula elijikelezayo (idivayisi yokusabalalisa ye-ultrasonic eyakhelwe ngaphakathi)
Isikhathi sokuhlaziya ukulinganisa Ngaphansi kweminithi elingu-1 ngaphansi kwezimo ezijwayelekile (kusukela ekuqaleni kokulinganisa kuya ekubonisweni kwemiphumela yokuhlaziya)
Okuqukethwe okukhiphayo Ukusabalalisa okuhlukile kwevolumu kanye nenani kanye namathebula okusabalalisa okukhulayo namagrafu; ububanzi obumaphakathi bezibalo; ulwazi lomsebenzisi; ulwazi lwesampula lokuhlola, ulwazi lwendawo yokusabalalisa, njll.
Indlela yokubonisa Ikhompyutha eyakhelwe ngaphakathi engu-10.8-intshi yezinga lezimboni, engaxhunywa kukhibhodi, igundane, idiski ye-U
Isistimu yekhompyutha Isistimu ye-WIN 10, umthamo we-hard disk engu-30GB, imemori yesistimu engu-2GB
ukunikezwa kwamandla kagesi 220V, 50Hz

Izimo zokusebenza:
1. Izinga lokushisa langaphakathi: 15℃-35℃
2. Izinga lokushisa elihlobene: akukho ngaphezu kwama-85% (akukho ukufingqa)
3. Kunconywa ukusebenzisa amandla kagesi we-AC 1KV ngaphandle kokuphazamiseka okunamandla kazibuthe.
4. Ngenxa yesilinganiso ebangeni le-micron, ithuluzi kufanele libekwe ebhentshini lokusebenza eliqinile, elithembekile, elingadlidlizi, futhi ukulinganisa kufanele kwenziwe ngaphansi kwezimo zothuli oluphansi.
5. Ithuluzi akufanele libekwe ezindaweni ezichayeke elangeni eliqondile, umoya onamandla, noma izinguquko ezinkulu zokushisa.
6. Izinto zokusebenza kufanele zibekwe phansi ukuze kuqinisekiswe ukuphepha nokunemba okuphezulu.
7. Ikamelo kufanele lihlanzeke, lingangeni uthuli, futhi lingagqwali.


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